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Where Aionik sits in chip fabrication

There are a handful of established ways to make a microfluidic chip. Each is good at something and each breaks down somewhere, and the pattern in where they break is the reason this company exists. This page sets out the landscape at the level of what each method can and cannot do.

The landscape

Five ways a chip gets made

The matrix compares every route on the same variables. The detail for each follows underneath. Costs and lead times are sourced on the process deep dive and the cleanroom page.

RouteCapital overheadIterationProduction scaleGeometry limitsOrganoid housingsSmall molecule uptake
PDMS soft lithographyExcels at iterationCleanroom, aligner, trained operatorHours to days in houseCannot scale to productionSurface relief only, bonded lidYes, layered, but the material absorbs media componentsHigh, plus protein adsorption and oligomer leaching
Hot embossingExcels at scaleLab press from a few thousand; commercial systems quote only, roughly $150k to $350k, plus a $5k to $50k insert per designWeeks per new insertYes, from roughly a thousand unitsThin sheet, surface relief onlyNo, thin sheet onlyLow in COC
Injection moldingExcels at scaleSteel tool per designWeeks per new toolYes, seconds per partSurface relief only, draft angles requiredNo, undercuts cannot demoldLow in COC
Glass and siliconSpecialist, neitherSemiconductor facility accessWeeksYes, but cost per chip stays high at every volumePlanar, etchedNo, planar etchNone
Resin printing, Aionik™ cureIteration and scaleDesktop printer and our unitPrint 20 min to 2 hrs by size and printer; cure 1 to 3 minSame process at any volumeFull 3D, enclosed volumes includedYes, printed in one pieceLow across printed resins generally; ours not yet measured

Row tints show what each route is good at: iteration, scale, or both. Within a row, green marks an advantage, oxblood marks a limitation, and grey means neutral or unknown. COC is cyclic olefin copolymer, a glassy thermoplastic used where PDMS absorption is unacceptable. Our own uptake figure is grey because we have not measured it, not because it is good.

PDMS soft lithography

Cast silicone against a photolithographic master mold. The academic standard for two decades, and the route most published microfluidics is built on.

Strengths

  • Optically clear and gas permeable, which suits live cell work
  • A mold is reusable, so the cost of the master is amortized across castings
  • Enormous published body of protocols and known geometry
  • Fine feature resolution, set by photolithography rather than by the casting

Limits

  • The master needs a cleanroom, which is a large fixed cost carried by one step
  • Every chip after the mold is hand work: pouring, degassing, punching, bonding
  • The plasma bond is a single attempt inside a window of roughly 15 minutes to an hour
  • Absorbs small hydrophobic molecules, which distorts drug and assay work
  • Adsorbs proteins onto the channel surface, which affects cell adhesion and depletes media components
  • Uncrosslinked oligomers leach out into the culture medium, so the material is not inert in a long running organoid experiment
  • Does not scale to production, and the seam remains the weak point

Hot embossing

A thermoplastic sheet heated just above its glass transition and pressed against a mold insert, then cooled and demolded. The middle route between soft lithography and injection molding.

Strengths

  • Tooling runs roughly $5,000 to $50,000, an order of magnitude below injection molding
  • Labs often improvise with a heated laboratory press costing a few thousand dollars, but commercial hot embossing and wafer bonding systems are sold on a quote basis, estimated at $150,000 to $350,000
  • Materials such as COC absorb far less than PDMS
  • Micron scale features with good replication fidelity
  • Economic from roughly a thousand units, so it bridges prototype and production

Limits

  • Still an insert per design, so a revision is new tooling
  • Surface replication only: no undercuts, no internal voids, and every part needs a separate bonding step, as with PDMS
  • High aspect ratio features are damaged on demold and need generous draft angles

Thermoplastic injection molding

Melted polymer injected into a hardened steel tool. The route a device takes once the design is frozen and the volume justifies the tooling.

Strengths

  • Genuine production scale, with parts produced in seconds
  • Very low cost per part once the tool exists
  • Materials such as COC, cyclic olefin copolymer, absorb far less than PDMS, which suits assay work
  • Repeatable enough for regulated manufacturing

Limits

  • Tooling is priced per design and a revision means a new block of steel
  • Locks the design before it has been validated, which inverts the research order
  • Weeks of lead time per iteration
  • Cannot produce enclosed or undercut three dimensional geometry in one part

Glass and silicon

Etched substrates using semiconductor fabrication. The route for chemistry, pressure, or optical requirements that polymers cannot meet.

Strengths

  • Chemical and thermal resistance beyond any polymer
  • The finest feature resolution available
  • No absorption of small molecules, and optically stable

Limits

  • Requires semiconductor facility access, which few labs have
  • Weeks per iteration
  • Cost per chip stays high at every volume
  • Brittle, and difficult to integrate with soft components

Resin printing with the Aionik™ cure

Print the part on standard SLA hardware, then run our patent pending post process in place of the chemical wash. No master, no mold, no cleanroom for the part itself.

Strengths

  • No master mold, so no cleanroom step and no tooling to amortize
  • A revision is a file edit, not a new tool, so the design loop closes in an afternoon
  • Cure runs 1 to 3 minutes on current production parts, and stays in minutes rather than hours as geometry scales
  • True three dimensional geometry, including enclosed volumes that no mold based route can demold
  • Optical clarity, smooth surfaces, and biocompatibility from general purpose resins
  • The same process at prototype and at production volume
  • A post process, so it composes with whatever the printer can resolve (how that works, and which printers apply)

Limits

  • Feature resolution is set by the printer, so the finest photolithographic geometry is still lithography's domain
  • Resin viscosity sets a working range, and for microfluidics the field already sits inside it. Low viscosity resins are preferred for this work regardless, both because they resolve finer features and because uncured resin clears out of a microchannel far more easily. Outside microfluidics, where a thicker specialty formulation might be wanted, compatibility is assessed case by case
  • Solvent compatibility follows the resin, not the process. Printed resins swell in DMSO, THF and toluene, which changes channel dimensions, though water, alcohols and nonpolar solvents are unaffected
  • Printed resin is not gas permeable the way PDMS is. Where a protocol relies on oxygen crossing the device wall that is a real constraint, though not a dead end: glass and thermoplastic devices supply oxygen through the perfused medium instead, which makes it a perfusion design problem rather than a material one. It also cuts the other way, since a permeable wall is how PDMS devices lose water to evaporation
  • Autofluorescence varies with the resin, and PDMS is among the lowest of any polymer. For demanding fluorescence imaging it is worth characterizing for the specific resin and application
  • These are the limits that matter most for microfluidic and organoid work. Others may apply to a particular application, and we would rather discuss yours than guess at it
The pattern

Every route is good at iterating or at producing, not both

Read the table above column by column rather than row by row and the same shape appears each time. The methods that let a researcher change a design quickly cannot make the part at volume. The methods that make it at volume require the design to stop changing first.

RouteCan it iterate quickly?Can it produce at volume?
PDMS soft lithographyYes, once the master existsNo
Injection moldingNo, a revision is a new toolYes
Glass and siliconNoAt high cost per chip
Resin printing with our cureYesYes, same process throughout

These routes are stages, not rivals

In practice a lab does not choose one of these. It uses several in sequence: prototype in PDMS because iteration is possible there, then move to hot embossing or injection molding when volume is needed. The routes depend on each other, and that dependency is the expensive part. The handoff costs a redesign for a new process, fresh tooling, and revalidation of a device that is no longer quite the device that was tested. Our process is meant to remove the handoff rather than any one of these routes, by holding the same material and the same process on both sides of it.

If you own none of it, you wait

Most labs own none of these processes, so they send the design to a contract manufacturer and buy finished chips. That is a sourcing decision rather than a fabrication method, which is why it is not in the matrix: the foundry runs one of the routes above on your behalf, and you inherit its limits along with its capabilities.

What you also inherit is the queue. Buying custom devices takes one to twelve weeks depending on the vendor and the complexity of the design, and every revision starts that clock again. Setup and tooling are charged per design, so cost moves with how unusual your geometry is and supply moves with how busy the vendor is. Researchers routinely wait months to hold a design they drew in an afternoon. The wait, not the invoice, is what actually limits how many questions a lab can ask in a year.

That split is the reason a device gets validated in one material and shipped in another. It is a structural feature of how these processes work, not a failure of anyone using them, and it is the specific gap our process is built to close.

Scope

The limits of what we claim

Five points worth stating precisely. Two mark where the process does not reach today, two are predictions we have not tested, and one is a gap in our own evidence. What we have demonstrated is on the homepage.

01

Lithography still owns the finest features

Today, where a design needs geometry finer than a printer resolves, photolithography and silicon remain the right tools. The hypothesis below is how that boundary could move, not a claim that it already has.

02

Hypothesis: finer printers, same cure

Ours is a post process, so in principle it applies to any resin printed part, including output from the highest resolution microfluidic printers on the market. If that holds, the finest printed geometry becomes curable the same way. We are testing it now.

03

Independent validation is a need, not a result

Our results are our own. Independent third party test data with published methodology is not yet part of the record, and we do not present it as though it were.

04

Lab on a chip is adjacent, not addressed

Integrated devices such as electrode bearing organoid chips look like a geometry and materials problem rather than new chemistry, which is why they are on our list to test. We have built none and we claim nothing here.

05

Absorption is reasoning, not measurement

Material class gives us good reason to expect a glassy printed resin takes up far less than an elastomer such as PDMS, and the published comparisons point the same way. That comparison is underway. We do not present our own results as validation.

Where that leaves it

The gap is between iterating and producing

Every established route sits on one side of it. Holding both sides in one material, with one process, is what we built.

See what we built